ABOUT INDEXING BOARD ARCHIVES AUTHOR GUIDELINES SUBMIT PAPER AUTHOR'S PAGE NEWS, EVENTS CONTACT
REVISTA DE CHIMIE
Cite as: Rev. Chim.
https://doi.org/10.37358/Rev.Chim.1949

OSIM Nr. R102355
ISSN Online 2668-8212
ISSN Print: 1582-9049
ISSN-L: 1582-9049

REVISTA DE CHIMIE Latest Issue

LATEST ISSUE >>>

   Volume 74, 2023
   Volume 73, 2022
   Volume 72, 2021
   Volume 71, 2020
   Volume 70, 2019
   Volume 69, 2018
   Volume 68, 2017
   Volume 67, 2016
   Volume 66, 2015
   Volume 65, 2014
   Volume 64, 2013
   Volume 63, 2012
   Volume 62, 2011
   Volume 61, 2010
   Volume 60, 2009
   Volume 59, 2008
   Volume 58, 2007
 
<<<< back

Revista de Chimie (Rev. Chim.), Year 2013, Volume 64, Issue 7,





MOHD ARIF ANUAR MOHD SALLEH, ABDULLAH MOHD MUSTAFA AL BAKRI, FLORA SOMIDIN, ANDREI VICTOR SANDU, NORAINIZA SAUD, HUSSIN KAMARUDDIN, STUART D. McDONALD, KAZUHIRO NOGITA
A Comparative Study of Solder Properties of Sn-0.7Cu Lead-free
Solder Fabricated Via the Powder Metallurgy and Casting Methods

Abstract:

The properties of Sn-0.7Cu solder bulk prepared via the powder metallurgy (PM) method were investigated and compared with solder bulk fabricated through casting. Distinct microstructures were observed in both PM and casting Sn-0.7Cu solder bulks. PM Sn-0.7Cu solder showed denser and finer Sn-grain structure, while cast Sn-0.7Cu showed larger Sn-rich dendrites with the presence of eutectic phase region. The mechanical performance of the solder bulk prepared with the PM technique was enhanced as it had higher microhardness value, UTS, and yield strength compared to the solder bulk prepared using the casting method. The solder wettability of the product was also increased using the PM method. Overall, the PM method can improve the mechanical and solderability properties of lead-free solder; therefore, it holds great potential as a new method for solder fabrication. Keywords: solder, intermetallics, powder metallurgy, mechanical, microstructure, wettability


Issue: 2013, Volume 64, Issue 7
Pages:
download pdf   Download Pdf Article
Creative Commons License
This article is published under the Creative Commons Attribution 4.0 International License
 
<<<< back
 
PUBLISHING SECTION
Author Guidelines
 * Paper Drafting
 * Paper Template
 * Ethical Statement
 * Paper Submission
Ghidul Autorului (ro)
Submit Paper
Author's Page
Publishing Ethics
Peer Review Process
Open Access & Archiving Policy
 Search Authors
 LATEST NEWS
REvista de Chimie NUMAR OMAGIAL PETRU PONI.. detalii
REvista de Chimie Revista de Chimie - 70 de ani de aparitie neintrerupta.. detalii
dictionar English-Romanian Dictionary for Mechanical Engineering
(download pdf)
  News, Events
Crossref Member Badge
DOI logo
Gold Open Access | Source=http://www.plos.org/ | Author=art designer at PLoS
Creative Commons License
 Conferences of Contemporary
 Chemistry
 Biblioteca Chimiei
 Materiale Plastice
REVISTA DE CHIMIE
About
Board
Indexing
Archives
Chemistry Conferences
News, Events
Resources
Contact
Site Map
PUBLISHING
Author Guidelines
   Paper Drafting Guide
   Paper Template
   Ethical Statement
   Paper Submission Guide
Ghidul Autorului (ro)
Publishing Ethics
PeerReviewProcess
Submit Paper
Author's Page
Search Authors
LEGAL
Privacy Policy
Cookie Policy
Open Access & Archiving Policy
Gold Open Access | Source=http://www.plos.org/ | Author=art designer at PLoS
CONTACT US
Journal Publisher:
REVISTA DE CHIMIE SRL
revistadechimiesrl.ro
Editorial Office Addres:
Calea Plevnei Nr. 139A
Sector 6, 060011, Bucuresti, ROMANIA
Phone: +4021 314 24 47
Mobile: +40730014437
Email: office@revistadechimie.ro
Facebook   Facebook   Facebook
(c) Shutterstock
 
REVISTA DE CHIMIE use Cookies. Please read our COOKIE POLICY page to learn more.